depot pull
Pay in 4 interest-free payments of $81.25 Learn more
Ships within 48 hours · Estimated delivery Sep 9 - Sep 14
Net weight: 25g
Back support
LoRaWAN® (v1
0 ×2 MIPI Camera / Display MIPI 4-lane interface ×2 (22pin 0
Better resolution
MECHANIC XG Series 183°C Tin Solder Paste Variants:XGSP80 Net weight: 25gMECHANIC XG Series 183C Tin Solder Paste (XG50 XGSP80 XGZ40) The MECHANIC XG Series 183C Tin Solder Paste is a high performance soldering solution designed for precision electronics work, including SMD soldering, BGA reballing, IC repair, and PCB rework applications. Engineered with a eutectic Sn63 Pb37 alloy composition, this solder paste offers a consistent melting point of 183C, ensuring smooth solder flow, strong joint formation, and reliable