Description
Package Size:580*310*265mm/Box
Automatic cleaning system
Flash Qualcomm
and the viewing binocular observation head can make 360
120X-MAX ( 3-IN-1 ) for iPhone X / XS / XS MAX Double Layers Board Pre-heating Rework Station
JC CNC Grinder EM03 EM02 Grinding Machine for iPhone PCB IC Repair Option:15-15PM Front/Back Grind Mold Package Size:580*310*265mm/BoxUpgraded JCID EM03 Intelligent CNC Grinder Automatic BGA Chip Grinding Mahine for iPhone 6 17 Pro Max Motherboard CPU IC SIM card slot grinding removal. JCID EM02 CNC Grinding Machine for iPhone 6 7 8 X 11 12 13 14 15 16 17 series BGA Chip IC grinding removing. JC EM03 CNC Grinder is used to grind and remove the CPU, Baseband, CHIP, HDD, WIFI, FONT chips of iPhone PCB without any damage in the motherboard, motherboard hardware iCloud unlock tool.