Description
Windows Vista 32/64-bit
11 Pro Max
Narrow heating platform
1x Keyboard
4pcs x Nozzles
HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Voltage:110V Windows Vista 32/64-bitHMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.