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Mbga-IP 26 IN 1 BGA Reballing Platform For iPhone 7 to 15 Pro Max Option:Mbga/MFix-UBase base Support 6-X logic chip reading

SKU 43219725569
4.6
2tskitsofficial.com
Description

Support 6-X logic chip reading and writing

All kinds of mobile phone motherboard SMT IC and LED lights

compatible for Macbook Air A1466 A1465

Qianli 3 IN 1 Pre-Heating Desoldering Platform for iPhone X XS MAX PCB -110V/220V

The extended platform is 330mm*200mm

Mbga-IP 26 IN 1 BGA Reballing Platform For iPhone 7 to 15 Pro Max Option:Mbga/MFix-UBase base Support 6-X logic chip readingAMAOE Mbga IP WiFi Baseband CPU NAND BGA Reballing Stencil Kit Soldering Steel Mesh Platform for iPhone 7 15 Pro Max. Mbga IP 26 in 1 BGA reballing stencil platform for Planting tin & Degumming CPU, hard drive, WIFI, baseband welding Repair. Option: Mbga IP 26 in 1 set ( 7 15PM) Mbga IP 14 14P kit Positioning plate Mbga IP 12 13 kit Positioning plate Mbga IP XS 11 kit Positioning plate Mbga IP 7 8 X Qualcomm kit Positioning plate Mbga IP 7 8 X Intel

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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